Welcome to 2017 International Conference on Design Engineering and Product Innovation (ICDEPI 2017). ICDEPI 2017 is organized by Hong Kong Society of Mechanical Engineers (HKSME), technical sponsored by Nanyang Technological University(NTU), Hong Kong Polytechnic University. The conference will be held at NTU, Singapore from July 12-14, 2017!
The conference is an international forum for the presentation of technological advances and research results in the fields of Design Engineering and Product Innovation.
Product Innovation
Design Processes
Design Methods and Tools
Product Development
In the last decade we have seen many new manufacturing technologies, new materials and new products and systems. The world has become digital and we move into the era of the Internet of Things and People. As before many of the changes are caused my technological progress, but they are pushed by economic and societal forces. Some parts of the world are moving towards the circular economy, while others remain focused on cost reductions.
In this fast changing world it is important for academics to meet, to share their research projects and to discuss relevant research topics for the future. Please be invited to come and meet other academics at the ICDEPI2017. It will give you an opportunity to learn from your colleagues working in different parts of the world, to share your ideas and to build collaborative ties that are critical to the progress in our field.
General Chair Prof. Cees de Bont Hong Kong Polytechnic University, Hong Kong
Day1-July 13: Registration
Day2-July 14: Keynote Speech+technical session
Day3-July 15: Invited speech+technical session+tour
Abstract Submission:May. 5, 2017
Full Paper Submission:May. 10, 2017
Notification Date:May. 25, 2017
Registration Deadline:June. 10, 2017
Conference Date:July 12-14, 2017
1. Author
2. Oral/Poster presenter
3. Invited Speaker
4. Reviewer
5. Voulunteer
Design Engineering
copyright@ICDEPI 2017
icdepi@smehk.org